Electromagnetics Plasma Simulation
Plasma-enhanced chemical vapor deposition (PECVD)
Simulation of Plasma Based Devices: Microwave Plasma & RF Plasma with Coupling Particle in Cell (PIC), MHD, CFD and FEA Solvers
Plasma-enhanced chemical vapor deposition coating:
Plasma-enhanced chemical vapor deposition (PECVD) is a thin-film deposition technique that allows for tunable control over the chemical composition of a thin film. The films typically deposited using PECVD are silicon nitride (SixNy), silicon dioxide (SiO2), silicon oxy-nitride (SiOxNy), silicon carbide (SiC), and amorphous silicon (α-Si). Silane (SiH4), the silicon source gas, is combined with an oxygen source gas to form silicon dioxide or a nitrogen gas source to produce silicon nitride.
Numerical methods used to solve multi-scale and multi phase models and to obtain qualitative results for the delicate multiphysical processes in the chamber. Such numerical simulations help us to economize on expensive physical experiments and obtain control mechanisms for the delicate deposition process.
Plasma-enhanced chemical vapor deposition (PECVD) is a thin-film deposition technique that allows for tunable control over the chemical composition of a thin film. The films typically deposited using PECVD are silicon nitride (SixNy), silicon dioxide (SiO2), silicon oxy-nitride (SiOxNy), silicon carbide (SiC), and amorphous silicon (α-Si). Silane (SiH4), the silicon source gas, is combined with an oxygen source gas to form silicon dioxide or a nitrogen gas source to produce silicon nitride.
Numerical methods used to solve multi-scale and multi phase models and to obtain qualitative results for the delicate multiphysical processes in the chamber. Such numerical simulations help us to economize on expensive physical experiments and obtain control mechanisms for the delicate deposition process.
The wider discipline
Plasma Simulation
We provide consulting services for the modeling and simulation of plasma and other flow systems. we combine expertise in physics, Numerical computing, big data processing, automation, and management. Our people are truly motivated experts, passionate about science. Our consulting services utilize our specialized domain expertise in plasma, reactive flows and surface chemistry mechanism development and integration with multi-dimensional flow and plasma systems.
OLTRION uses advanced electromagnetic FEA, CFD and particle-in-cell (PIC) codes, designed for executing multi-scale, plasma physics simulations. Based on the problem and its detail, we use special commercial …
OLTRION uses advanced electromagnetic FEA, CFD and particle-in-cell (PIC) codes, designed for executing multi-scale, plasma physics simulations. Based on the problem and its detail, we use special commercial …
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